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• 封裝芯片：Philips I-CODE-2 (I-CODE-SLI )
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• 標簽厚度： 0.28mm
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• 存儲容量:1024 bit，16個分區，64 bit 唯一ID序列號
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• 工作頻率:13.56KHz 
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• 讀寫距離:3-10cm 
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• 工作溫度:-20℃～55℃
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• 擦寫壽命:>100,000次
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•  執行標準:ISO15693
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• 封裝材料：格拉辛紙、牛皮紙 聚酯PET 銅版紙 聚乙烯polyC
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• 外形尺寸：50X0X0.28MM，【可根據客戶要求訂做】 

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  NXP I CODE SLE不干膠電子標簽的結構：

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  把標簽的天線嵌進塑料物體當中通常采用蝕刻，電鍍技術：嵌入到紙張當中則采用膠版印刷、絲網印刷和膠印技術。僅通過一個簡單的熱蒸發過程就可以讓鋁質線圈天線在紙上成形，并組成完整的RFID標簽。鋁比銅或銀更便宜，目前已經在各種標簽廣泛使用。研究表明，該方法會降低五分之一的成本。不干膠電子標簽用紙、合成紙或PET作為基層材料，采用銀天線印刷工藝制作，單層結構，不需制作Inlay。
  NXP I CODE SLE不干膠電子標簽的典型應用：

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  物流管理，商品零售業，產品跟蹤，產品防偽，倉儲管理，生產控制，車輛管理等。例如：醫藥行業-藥瓶管理；珠寶行業-庫存管理和防盜；白酒行業-銷售跟蹤和防盜等。

  
   

  
  
  
  
   

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